Panasonic EZASC user manual

Summary of the content on the page No. 1

Chip 3-Terminal Capacitor Array
Chip 3-Terminal Capacitor Ar ray
Type:
EZASC

EZANC
GND GND
■ Features
1. Suitable for EMI suppression fi ltering
● The low residual inductance at high frequency range provides effective reduction of noise
● Equivalent noise reduction to the EMI fi lters with low cost design
2. Compact design for high density PWB assembly
● EZASC : 4.0 mm
2.1 mm
0.65 mm, 0.8 mm pitch
EZANC : 6.4 mm
3.1 mm
0.75 mm, 1.27 mm pitch
● Flat and square packages suit

Summary of the content on the page No. 2

CIOI Chip 3-Terminal Capacitor Array ■ Explanation of Part Number 1 2 3 4 5 6 7 8 9 10 11 E Z A N C E 1 0 1 M Product Code Dimensions and Temperature Capacitance Value Capacitance Suffix for Special Circuit Configuration Characteristics Tolerance Requirement 4.0 mm Thick Film Noise +20 %/–55 % The first two digits are significant ±20 % SC E (–25°Cto+85 °C) +30 % Suppression and
2.1 mm Four 3-Terminal figures of capacitance value, When less M –20 % Capacitors Filtering 6.4 mm and the third one d

Summary of the content on the page No. 3

22pF 47pF 100pF 220pF 470pF Chip 3-Terminal Capacitor Array ■ Ratings Specifi cation Item EZASC EZANC Capacitance Values 10 pF to 180 pF 22 pF, 47 pF, 100 pF, 220 pF, 470 pF (1) (25 °C, 1 kHz , 1 Vrms) Standard : 22 pF, 47 pF, 100 pF +30% Capacitance Tolerance ±20% ( in the case of Less than 22 pF) –20% Temperature Characteristic E Characteristic: +20 %/±55 % (±25 °C to +85 °C) (1) Dissipation Factor Less than 2 % (25 °C, 1 kHz , 1 Vrms) Rated Voltage 25 V (2) Rated Current 200 mA 300 mA (3) Resi

Summary of the content on the page No. 4

Chip 3-Terminal Capacitor Array ● Embossed Carrier Taping ● Taping Reel t1 Compartment T Sprocket hole f D0 A fC f D1 t2 P P P Tape running direction 1 2 0 Chip component fA W Type A B W F E P 0 ±0.20 ±0.20 EZASC 2.50 4.40 Dimensions ±0.30 ±0.20 ±0.20 ±0.10 12.00 5.50 1.75 4.00 (mm) ±0.20 ±0.20 EZANC 3.50 6.80 fA fB fC Dimensions (mm) +0 ±1.0 180−3.0 60 min. 13.0 Type P P fD t t fD 1 2 0 1 2 1 ±0.20 EZASC 1.15 WT Dimensions Dimensions ±0.10 ±0.05 +0.10 ±0.05 +0.10 4.00 2.00 1.50−0 0.25 1.50−0 (m

Summary of the content on the page No. 5

Chip 3-Terminal Capacitor Array ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for refl ow For soldering (Example : Sn/Pb) ·Refl ow soldering shall be performed a maximum of two times. Temperature Time ·Please contact us for additional information when Preheating 140 °C to 160 °C 60 s to 120 s used in conditions other than those specifi ed. Main heating Above 200 °C 30 s to 40 s ·Please measure the temperature of the t

Summary of the content on the page No. 6

Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])  When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice.  Do not use the products beyond the specifi cations described in this catalog.  This catalog explains the quality and performance of the products as individ