Resumo do conteúdo contido na página número 1
Resumo do conteúdo contido na página número 2
Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication. This publication and an
Resumo do conteúdo contido na página número 3
Contents Chapter 1: Introduction ........................... 1 - 1 System specifications (general) ...................1 - 2 Chapter 2: Chipset and Mainboard information ............................ 2 - 1 CPU ...............................................................2 - 1 Chipsets ........................................................2 - 3 SiS630S ............................................................ 2 - 3 PC Card Chipset - PCI1410 ............................. 2 - 11 Ports ........
Resumo do conteúdo contido na página número 4
Remove the battery............................................. 3 - 5 Remove the keyboard ......................................... 3 - 6 Remove the HDD assembly ................................ 3 - 7 Remove the CD-ROM\DVD-ROM assembly ......... 3 - 8 Remove the heat sink ......................................... 3 - 9 Applying a heat sink pad .................................... 3 - 9 Remove the CPU .............................................. 3 - 10 Reinstall the CPU ........................
Resumo do conteúdo contido na página número 5
LCD panel (14.1”) assembly and parts list ........... A - 4 Keyboard and Touchpad assembly ..................... A - 5 Keyboard and Touchpad assembly parts list ........ A - 6 FDD assembly and parts list ............................... A - 7 HDD assembly and parts list ............................... A - 8 CD-ROM assembly and parts list......................... A - 9 DVD-ROM assembly and parts list .................... A - 10 2700C .........................................................A - 11
Resumo do conteúdo contido na página número 6
Introduction Chapter 1: Introduction This manual covers information you will need to service or upgrade your Notebook Computer. Information about operating the computer (e.g. getting started, etc...) is in the User’s Manual. Driver Information is also found in the User’s Manual. The User’s Manual is shipped with the computer. Operating Systems (Windows ME, Windows 2000, etc.) have their own manuals as do application software. If you have any questions regarding those, please consult their user
Resumo do conteúdo contido na página número 7
Service Manual System specifications (general) The main unit of the Model 2200C/2700C Notebook PC has the following components: – Intel FC-PGA370 Pentium III with AGP technology-based mainboard, using the SiS630S chipset solution supporting SDRAM with 0MB on-board DRAM, expandable to 32MB, 64MB, 96MB, 128MB, 192MB, 256MB, or 512MB using one or two expansion SODIMMs – user-installed modules: CD-ROM or DVD or CD-RW ROM – main storage (HDD) bay: principal HDD 2.5” 12.7/9.5mm, supports PIO mode 4/AT
Resumo do conteúdo contido na página número 8
Introduction CPU ( FC-PGA370 ) Keyboard Intel Celeron-450 (1.6V) Keys 84 Intel Celeron-500 (1.6V) Fn key support YES Intel Celeron-550 (1.6V) Integrated numeric keypad YES Intel Pentium III-600 (1.65V) Inverted “T” layout cursor keys YES Intel Pentium III-650 (1.65V) Intel Pentium III-700 (1.65V) HDD Intel Pentium III-750 (1.65V) Easy change module 6GB or up Intel Pentium III-800 (1.65V) Drive size 2.5” Intel Pentium III-850 (1.65V) Height maximum 12.7mm Intel Pentium III-866 (1.65V) Average acc
Resumo do conteúdo contido na página número 9
Service Manual Transport drawer type load/eject Speaker-out Jack YES Interface PCI local bus master IDE Microphone-in Jack YES BIOS Power Supply InSyde 256KB AC adapter AC-in 100-240V/47-63Hz Capacity 65W Display Battery pack NiMH/Li-Ion LCD/CRT (simultaneous) YES VGA/EGA/CGA/Hercules compatible YES Power Saving Management AGP 3D graphics accelerator YES Adjustable brightness YES (standard) Doze mode YES PS/2 Sleep mode YES Suspend/Resume mode YES LCD\TFT Suspend to HDD mode YES Backlight CCFT H
Resumo do conteúdo contido na página número 10
Introduction External 101/102 keyboard port/ PS/2 mouse x 1 PC Card Standard Type I or Type II x 1 Modem (RJ-11) port for MDC x 1 (optional) USB connector x 2 speaker-out jack x 1 microphone-in jack x 1 LAN (RJ45) port x 1 Physical Dimension 308 mm(W) 254 mm(D) 37.5 mm(H) Weight 3.2KG (with Lithium-lon battery) 1 - 5
Resumo do conteúdo contido na página número 11
Notes
Resumo do conteúdo contido na página número 12
Chipset and Mainboard information Chapter 2: Chipset and Mainboard information CPU The 2200C/2700C Notebook PC uses the Intel Mobile Pentium III/Celeron (.18) processor in an FC- PGA370 package. The Intel Mobile Pentium III/Celeron (.18) processor features an integrated L2 cache (256KB for Pentium III and 128KB for Celeron (.18)) and a 64-bit high performance system bus. The Mobile Pentium III/Celeron (.18) processor’s 64-bit wide Low Power Gunning Transceiver Logic system bus is compatible wit
Resumo do conteúdo contido na página número 13
Service Manual - 128/256-Kbyte, ECC protected cache data array – Low Power GTL+ system bus interface - 64-bit data bus, 100-MHz operation - Uniprocessor, two loads only (processor and I/O bridge/memory controller) - Short trace length and low capacitance allows for single ended termination – Voltage reduction technology – Pentium III processor clock control - Quick Start for low power, low exit latency clock ‘throttling’ - Deep Sleep mode for extremely low power dissipation – Thermal diode for m
Resumo do conteúdo contido na página número 14
Chipset and Mainboard information Chipsets SiS630S The single chipset, SiS630S, provides a high performance/low cost Desktop solution for the Intel Slot 1 and socket 370 series CPU based systems by integrating a high performance North Bridge, ad- vanced hardware 2D/3D GUI engine, Super-South bridge or an external AGP4X Slot. In addition, SiS630S provides a system-on-chip solution that complies with the Easy PC Initiative which sup- ports Instantly Available/OnNow PC technology, USB, Legacy Remo
Resumo do conteúdo contido na página número 15
Service Manual width. The built-in fast PCI IDE controller supports the ATA PIO/DMA, and the Ultra DMA33/66/100 function that supports the data transfer rate up to 100 MB/s. It provides the separate data path for two IDE channels that can eminently improve the performance under the multi-tasking environ- ment. The following illustrates the system block diagram Features Host Interface Controller – Supports Intel Slot 1/Socket370 Pentium II/!!! CPUs – Synchronous Host/DRAM Clock Scheme – Asynchron
Resumo do conteúdo contido na página número 16
Chipset and Mainboard information Integrated A.G.P. Compliant Target/66Mhz Host-to-PCI Bridge – AGP v2.0 Compliant – Supports Graphic Window Size from 4MBytes to 256MBytes – Supports Pipelined Process in CPU-to-Integrated 3D A.G.P. VGA Access – Supports 8 Way, 16 Entries Page Table Cache for GART to Enhance Integrated A.G.P. VGA Controller Read/Write Performance – Supports PCI-to-PCI Bridge Function for Memory Write from 33Mhz PCI Bus to Integrated A.G.P. VGA – Supports Additional AGP slot with
Resumo do conteúdo contido na página número 17
Service Manual – Native Mode and Compatibility Mode – PIO Mode 0, 1, 2 , 3, 4 – Multiword DMA Mode 0, 1, 2 – Ultra DMA 33/66/100 – Two Independent IDE Channels Each with 16 DW FIFO Virtual PCI-to-PCI Bridge Integrated Ultra AGP VGA for Hardware 2D/3D Video/Graphics Accelerators – Supports Tightly Coupled 64 Bits Host Interface to VGA to Speed Up GUI Performance and Video Playback Frame Rate – AGP v. 2.0 Compliant – Zero-Wait-State 128x4 Post-Write Buffer with Write Combine Capability – Zero-Wait
Resumo do conteúdo contido na página número 18
Chipset and Mainboard information – Supports YUV-To-RGB Color Space Conversion – Supports Graphic and Video Overlay Function – Supports CD/DVD to TV Playback Mode – Simultaneous Graphic and TV Video Playback Overlay – Supports RGB555, RGB565, YUV422 and YUV420 Video Playback Format – Supports Filtered Horizontal Up and Down Scaling Playback – Supports DVD Sub-Picture Playback Overlay – Supports DVD Playback Auto-Flipping – Built-in Two Video Playback Line Buffers – Built-in Programmable 24-bit
Resumo do conteúdo contido na página número 19
Service Manual – Low Resolution Modes – Supports Virtual Screen up to 4096x4096 – Fully Directx 7.0 Compliant – Efficient and Flexible Power Management with ACPI Compliance Low Pin Count Interface – Forwards PCI I/O and Memory Cycles into LPC Bus – Translates 8-/16-bit DMA Cycles into PCI Bus Cycles Advanced PCI H/W Audio & Modem Advanced Power Management – Meets ACPI 1.0 Requirements – Meets APM 1.2 Requirements – ACPI Sleep States Include S1, S3, S4, S5 – CPU Power States Include C0, C1, C2 C3
Resumo do conteúdo contido na página número 20
Chipset and Mainboard information – Two 8237A Compatible DMA Controllers – 8/16- bit DMA Data Transfer – Distributed DMA Support Integrated Interrupt Controller – Two 8237A Compatible DMA Controllers – Two 8259A Compatible Interrupt Controllers – Level- or Edge-Triggered Programmable – Serial IRQ – Interrupt Sources Re-routable to Any IRQ Channel Three 8254 Compatible Programmable 16-bit Counters – System Timer Interrupt – Generate Refresh Request – Speaker Tone Output Integrated Keyboard Cont
