Resumo do conteúdo contido na página número 1
COM 830
(Computer-On-Module)
Reference Manual
P/N 5001829A Revision A
Resumo do conteúdo contido na página número 2
Notice Page NOTICE No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise, without the prior written permission of Ampro Computers, Incorporated. DISCLAIMER Ampro Computers, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated Am
Resumo do conteúdo contido na página número 3
Contents Chapter 1 About This Manual ....................................................................................................1 Symbols ...........................................................................................................................................1 Warning .................................................................................................................................1 Caution .................................................................
Resumo do conteúdo contido na página número 4
Contents Secondary Connector Rows C and D ...................................................................................... 15 PCI Express Graphics (PEG)................................................................................................... 15 SDVO ....................................................................................................................................... 15 PCI Bus .......................................................................................
Resumo do conteúdo contido na página número 5
Contents Chapter 4 BIOS Setup Description..........................................................................................53 Entering the BIOS Setup Program.................................................................................................53 Boot Selection Popup ...............................................................................................................53 Manufacturer Default Settings ......................................................................
Resumo do conteúdo contido na página número 6
Contents List of Tables Table 1-1. Definitions of Terms ................................................................................................ 1 Table 1-2. COM Express Pinout Types .................................................................................... 2 Table 1-3. COM 830 Configuration Matrix................................................................................ 3 Table 2-1. Feature Summary..........................................................................
Resumo do conteúdo contido na página número 7
Chapter 1 About This Manual This manual provides information about the components, features, connectors and BIOS Setup menus available on the COM 830. Symbols The following symbols are used in this manual: Warning Warnings indicate conditions that, if not observed, can cause personal injury. Caution Cautions warn the user about how to prevent damage to hardware or loss of data. Note Notes call attention to important information that should be observed. Terminology Table 1-1. Definitions of Te
Resumo do conteúdo contido na página número 8
Chapter 1 About This Manual Beginning on the date of shipment to its direct customer and continuing for the published warranty period, Ampro represents that the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at Ampro's option and expense. Customer will obtain a Return Material Authorization ("RMA") number from A
Resumo do conteúdo contido na página número 9
Chapter 1 About This Manual Carrier board designers can utilize as little or as many of the I/O interfaces as necessary. The carrier board can therefore provide all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™ modules are scalable, which means once an appli
Resumo do conteúdo contido na página número 10
Chapter 1 About This Manual 4 Reference Manual COM 830
Resumo do conteúdo contido na página número 11
Chapter 2 Specifications Feature List Table 2-1. Feature Summary Based on COM Express™ standard pinout Type 2 (Basic size 95 x 125mm) Form Factor Intel® Core™ Duo U2500 ULV 1.2GHz, with 2-MByte L2 cache ULV (Ultra Processor Low Voltage) Intel® Celeron M 423 ULV 1.07GHz, with 1-MByte L2 cache (Ultra Low Voltage) 2 sockets: SO-DIMM DDR2 667 up to 4-GByte physical memory. Sockets located Memory top and bottom side of module. ® Graphics and Memory Controller Hub (GMHC) Intel 82945GM Chipset ®
Resumo do conteúdo contido na página número 12
Chapter 2 Specifications Table 2-1. Feature Summary (Continued) ® BIOS Based on AMIBIOS8 -1MByte Flash BIOS with Embedded BIOS features. ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3). Power Management NOTE Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the option information listed in Tables 2-3 and 2-4 on page 9 of this manual to determine what options are available on your
Resumo do conteúdo contido na página número 13
Chapter 2 Specifications Electrostatic Sensitive Device All COM 830 variants are electrostatic sensitive devices. Do not handle the COM 830, or processor, except at an electrostatic-free workstation. Failure to do so may cause damage to the module and/or processor and void the manufacturer’s warranty. Supply Voltage Standard Power 12V DC ± 5% Electrical Characteristics Power supply pins on the module's connectors limit the amount of input power. The following table provides an overview of the
Resumo do conteúdo contido na página número 14
Chapter 2 Specifications Windows XP Professional Standby Mode (requires setup node “Suspend Mode” in the BIOS to be configured to S1 POS [Power On Suspend]) Suspend to RAM (requires setup node “Suspend Mode” in BIOS to be configured to S3 STR [suspend to RAM]) NOTE The PassMark, Burn-In Test-Suite was used to stress the CPU to 100% workload. Processor Information ® In the following power tables there is some additional information about the processors. Intel offers processors that are conside
Resumo do conteúdo contido na página número 15
Chapter 2 Specifications ® Table 2-4. COM 830 Intel Celeron M 423 1.07GHz 1MB L2 cache COM 830-R-10 ® Intel Celeron M 423 1.06GHz 1MB L2 cache ULV 65nm 512MB Memory Size Windows XP Professional SP2 Operating System Power State Desktop Idle 100% Standby (S1) Suspend to workload Ram (S3) 1.26A/15.10W 1.90A/22.82W 1.60A/19.23W 0.82A/9.86W Power consumption (measured in Amperes/Watts) NOTE All recorded power consumption values are approximate and only valid for the controlled environment desc
Resumo do conteúdo contido na página número 16
Chapter 2 Specifications Block Diagram Composite Video Component Video OR TV-Out PCI Express Graphics x16 S-Video GMCH x16 OR CRT 2x SDVO Intel 82945GM LCD I/F (LVDS) DDR2-SODIMM Socket (top) Memory Bus (533 or 667MHz) SM Bus DDR2-SODIMM Socket (bottom) AC’97 Digital Audio / HDA Interface PCI Bus 8x USB 2.0 1x IDE (Primary) 2x SATA GPIs/GPOs LPC Bus 5x x1 PCIe Lanes Gbit Ethernet 1x x1 PCIe Lane Power Management and Control Signals SPI I2C Fan Control 10 Reference Manual COM 830 Syst
Resumo do conteúdo contido na página número 17
Chapter 2 Specifications Heatspreader An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module. It is a 3mm thick aluminum plate. The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the heat gene
Resumo do conteúdo contido na página número 18
Chapter 2 Specifications Heatspreader Dimensions Heatspreader is available for all variants of COM 830. NOTE All measurements are in millimeters. Torque specification for heatspreader screws is 0.5 Nm. 12 Reference Manual COM 830
Resumo do conteúdo contido na página número 19
Chapter 2 Specifications Connector Subsystems Rows A, B, C, D The COM 830 is connected to the carrier board via two 220-pin connectors (COM Express Type 2 pinout) for a total of 440 pins connectivity. These connectors are broken down into four rows. The primary connector consists of rows A and B while the secondary connector consists of rows C and D. In this view the connectors are seen “through” the module. Primary Connector Rows A and B The following subsystems can be found on the primary co
Resumo do conteúdo contido na página número 20
Chapter 2 Specifications PCI Express™ The COM 830 offers 6x x1 PCI Express lanes via the Intel 82801GHM (ICH7M-DH), which can be configured to support PCI Express edge cards or ExpressCards. One of the six x1 PCI Express lane is utilized by the onboard Ethernet controller therefore there are only 5x x1 PCI Express lanes available on the A,B connector row. The PCI Express interface is based on the PCI Express Specification 1.0a. ExpressCard™ The COM 830 supports the implementation of ExpressCa
