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SMCJ5.0(C)A - SMCJ170(C)A
SMCJ5.0(C)A - SMCJ170(C)A
Features
• Glass passivated junction.
• 1500 W Peak Pulse Power capability
on 10/1000 µ s waveform.
• Excellent clamping capability.
• Low incremental surge resistance.
• Fast response time; typically less
SMC/DO-214AB
than 1.0 ps from 0 volts to BV for
COLOR BAND DENOTES CATHODE
unidirectional and 5.0 ns for
ON UNIDIRECTIONAL DEVICES ONLY.
NO COLOR BAND ON BIDIRECTIONAL
bidirectional.
DEVICES.
• Typical I less than 1.0 µ A above 10V.
R
• UL ce
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SMCJ5.0(C)A - SMCJ170(C)A Transient Voltage Supressors (continued) Electrical Characteristics T = 25°C unless otherwise noted A Uni-directional Part Reverse Breakdown Voltage Test Max Clamping Max Peak Pulse Max Reverse Bi-directional (C) Marking* Stand-off Voltage V (V) Current Voltage @IPPM Surge Current Leakage V BR RWM Device V (V) min max I (mA) V (V) I (A) I (uA)** RWM T C PPM R SMCJ5.0(C)A GDE 5.0 6.40 7.0 10 9.2 1
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SMCJ5.0(C)A - SMCJ170(C)A Transient Voltage Supressors (continued) Typical Characteristics Pulse Derating Curve Peak Pulse Power Rating Curve 100 100 75 T = 25 C º A 10 50 1 25 0 0.1 0 25 50 75 100 125 150 175 200 0.0001 0.001 0.01 0.1 1 10 AMBIENT TEMPERATURE (º C) PULSE WIDTH (ms) Pulse Waveform Junction Capacitance 150 20000 T = 25 C º T = 25 C º A A Pulse Width (td) is Defined 10000 f = 1.0 MHz tf = 10µµ sec
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F924 B34 F924 B34 F924 B34 F924 B34 F924 B34 DO-214AB(SMC) Tape and Reel Data DO-214AB(SMC) Packaging Configuration: Figure 1.0 Packaging Description: DO-214AB(SMC) parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. Alternate carrier tape is made of anti- static plastic. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static Antistatic Co
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DO-214AB(SMC) Tape and Reel Data, continued DO-214AB(SMC) Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F W K0 E2 Wc B0 Tc A0 P1 D1 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc DO-214AB(SMC) 6.00 8.25 16.0 1.55 1.125 1.75 10.25 7.5 8.0 4.0 2.4 0.40 13.0 0.06 (12mm) +/-0.15 +/-0.20 +/-0.3 +/-0.05 +/-0.125 +/-0.10 min +/-0.05 +/-0.1 +/-0.1 +/-0.30 +/-0.10 +/-0.3 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect
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DO-214AB(SMC) Package Dimensions DO-214AB(SMC) (FS PKG Code P7) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.21 0.280 (7.112) 6.18 0.260 (6.604) 5.98 3.27 0.128 (3.25) 0.245 (6.223) 2 0.108 (2.743) 1 3.07 0.220 (5.588) + 0.320 (8.128) 4.69 0.305 (7.747) 4.49 7.67 7.47 0.103 (2.616) Minimum Recommended 0.079 (2.007) Land Pattern 0.012 (0.305) 0.060 (1.524) 0.030 (0.762) 0.006 (0.152) 0.008 (0.203) 0.002 (0.51) August 1999,
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TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. SuperSOT™-3 ACEx™ FAST PACMAN™ SuperSOT™-6 Bottomless™ FASTr™ POP™ SuperSOT™-8 CoolFET™ GlobalOptoisolator™ PowerTrench SyncFET™ CROSSVOLT™ GTO™ QFET™ TinyLogic™ DenseTrench™ HiSeC™ QS™ UHC™ DOME™ ISOPLANAR™ QT Optoelectronics™ UltraFET EcoSPARK™ LittleFET™ Quiet Series™ 2 TM VCX™ E CMOS MicroFET™ SIL
