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® ® Δ
Intel Celeron Processor 200
Sequence
Thermal and Mechanical Design Guidelines
® ® Δ
— Supporting the Intel Celeron processor 220
October 2007
318548-001
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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO
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Contents 1 Introduction.....................................................................................................7 1.1 Document Goals and Scope .....................................................................7 1.1.1 Importance of Thermal Management............................................7 1.1.2 Document Goals........................................................................7 1.1.3 Document Scope...............................................................
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Appendix A Heatsink Clip Load Metrology............................................................................43 A.1 Overview ............................................................................................43 A.2 Test Preparation...................................................................................43 A.2.1 Heatsink Preparation ...............................................................43 A.2.2 Typical Test Equipment ..................................
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Tables Table 1. Micro-FCBGA Package Mechanical Specifications.....................................12 ® ® Table 2. Thermal Specifications for Intel Celeron Processor 200 Sequence ..........19 Table 3. System Thermal Solution Design Requirement .......................................22 Table 4. Test Accessories ................................................................................33 Table 5. Typical Test Equipment.........................................................
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Revision History Revision Description Revision Date Number -001 • Initial Release October 2007 § 6 Thermal and Mechanical Design Guidelines
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Introduction 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system dama
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Introduction 1.1.3 Document Scope This design guide supports the following processors: ® ® ® ® • Intel Celeron Processor 200 sequence applies to the Intel Celeron processor 220. In this document the Intel Celeron Processor 200 sequence will be referred to as “the processor”. In this document when a reference is made to “the processor” it is intended that this includes all the processors supported by this document. If needed for clarity, the specific processor will be listed. I
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Introduction 1.2 Reference Documents Material and concepts available in the following documents may be beneficial when reading this document. Document Document No./Location ® ® Intel Celeron Processor 200 Sequence Datasheet http://developer.intel .com/design/processo r/datashts/318546.ht m Power Supply Design Guide for Desktop Platform Form Factors (Rev http://www.formfacto 1.1) rs.org/ ATX Thermal Design Suggestions http://www.formfactors. org/ microATX Thermal Design Sugges
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Introduction Term Description (T – T ) / Total Package Power. S A Note: Heat source must be specified for Ψ measurements. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor die surface. This material fills the air gaps and voids, TIM and enhances the transfer of the heat from the processor die surface to the heatsink. Processor total power dissipation (assuming all power dissipates through the P D processor die). Thermal Design
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Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package, as shown in Figure 1 to Figure 3. The processor uses a Flip-Chip Ball Grid Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint on PCB surface. Mechanical specifications of the package are listed in Table 1. Refer to the data
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Processor Thermal/Mechanical Information Table 1. Micro-FCBGA Package Mechanical Specifications Symbol Parameter Min Max Unit Figure B1 Package substrate width 34.95 35.05 mm Figure 2 B2 Package substrate length 34.95 35.05 mm Figure 2 C1 Die width 11.1 mm Figure 2 C2 Die length 8.2 mm Figure 2 F2 Die height (with underfill) 0.89 mm Figure 2 F3 Package overall height 2.022 Max mm Figure 2 (package substrate to die) G1 Width (first ball center to 31.75 Basic mm Figure 2 las
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Processor Thermal/Mechanical Information Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View Thermal and Mechanical Design Guidelines 13
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Processor Thermal/Mechanical Information Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details. 14 Thermal and Mechanical Design Guidelines
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Processor Thermal/Mechanical Information Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details. Thermal and Mechanical Design Guidelines 15
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Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The micro-FCBGA package may have capacitors placed in the area surrounding the processor die. The die-side capacitors, which are only slightly shorter than the die height, are electrically conductive and contact with electrically conductive materials should be avoided. The use of an insulating material between the capacitors and any thermal and mechanical solution should be considered to pr
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Processor Thermal/Mechanical Information depending on clip stiffness, the initial preload at beginning of life of the product may be significantly higher than the minimum preload that must be met throughout the life of the product. Refer to Appendix A for clip load metrology guidelines. 2.1.2.3 Heatsink Attach Mechanism Design Considerations In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guide
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Processor Thermal/Mechanical Information Figure 4. Vertical Lock-Down Alignment Feature Figure 5. Various Types of Solder Crack 2.2 Thermal Requirements The processor requires a thermal solution to maintain temperatures within operating limits. Refer to the datasheet for the processor thermal specifications. To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should remain within the mini
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Processor Thermal/Mechanical Information 2.2.1 Processor Junction Temperature ® ® Table 2. Thermal Specifications for Intel Celeron Processor 200 Sequence Core Thermal Design Processor Frequency Symbol Cache Power Notes Number and (W) Voltage TDP 220 1.20 GHz 512 KB 19 1, 4, 5 Symbol Parameter Min Max Notes T (°C) Junction Temperature 0 °C 100 °C 3, 4 J NOTE: 1. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power spe
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Processor Thermal/Mechanical Information air, T , and the local air velocity over the surface. The higher the air velocity over A the surface, and the cooler the air, the more efficient is the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes in particular the fin faces and the heatsink base. Active heatsinks typi
