Streszczenie treści zawartej na stronie nr. 1
R
mPGA604 Socket
Design Guidelines
Revision 1.0
October 2003
Document Number: 254239-001
Streszczenie treści zawartej na stronie nr. 2
R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your product order. ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
Streszczenie treści zawartej na stronie nr. 3
R Contents 1 Introduction ....................................................................................................................... 9 1.1 Objective ................................................................................................................ 9 1.2 Purpose.................................................................................................................. 9 1.3 Scope .............................................................................
Streszczenie treści zawartej na stronie nr. 4
R 5 Environmental Requirements ........................................................................................ 29 5.1 Porosity Test ........................................................................................................ 30 5.1.1 Porosity Test Method .............................................................................. 30 5.1.2 Porosity Test Criteria .............................................................................. 30 5.2 Plating Thickness.
Streszczenie treści zawartej na stronie nr. 5
R Tables 2-1 Package Critical-To-Function (CTF) Dimensions ................................................ 11 3-1 Socket Critical-to-Function Dimensions...............................................................17 4-1 Electrical Requirements for Sockets.................................................................... 19 4-2 Definitions............................................................................................................19 4-3 Resistance Test Fixtures Netl
Streszczenie treści zawartej na stronie nr. 6
R Revision History Revision Description Date Number 1.0 • Initial release of the document. October 2003 6 mPGA604 Socket Design Guidelines
Streszczenie treści zawartej na stronie nr. 7
R Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented. Typical examples of significant changes include, but are not limited to, the following: plastic
Streszczenie treści zawartej na stronie nr. 8
R This page intentionally left blank. 8 mPGA604 Socket Design Guidelines
Streszczenie treści zawartej na stronie nr. 9
R 1 Introduction 1.1 Objective This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604 socket contacts have 50mil pitch with regular pin array, to mate with
Streszczenie treści zawartej na stronie nr. 10
R Introduction This page intentionally left blank. 10 mPGA604 Socket Design Guidelines
Streszczenie treści zawartej na stronie nr. 11
R 2 Assembled Component and Package Description Information provided in this section is to ensure dimensional compatibility of the mPGA604 socket with that of the 604-pin processor package. The processor package must be inserted into the mPGA604 socket with zero insertion force when the socket is not actuated. 2.1 Assembled Component Description The assembled component may consist of a heatsink, EMI shield, clips, fan, retention mechanism (RM), and processor package. Specific details
Streszczenie treści zawartej na stronie nr. 12
R Assembled Component and Package Description This page intentionally left blank. 12 mPGA604 Socket Design Guidelines
Streszczenie treści zawartej na stronie nr. 13
R 3 Mechanical Requirements 3.1 Mechanical Supports A retention system needs to isolate any load in excess of 50 lbf, compressive, from the socket during the shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical shock and vibration requirements listed in Sections 5 with the associated heatsink and retention mechanism attached. socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive, etc.) m
Streszczenie treści zawartej na stronie nr. 14
R Mechanical Requirements Proper seating 3.5 Markings All markings required in this section must be able to withstand a temperature of 240°C for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5. 3.5.1 Name mPGA604 (font type is Helvetica Bold – minimum 6 point). This mark shall be molded or Laser Marked into the processor side of the socket housing. Manufacturer’s insignia (fon
Streszczenie treści zawartej na stronie nr. 15
R Mechanical Requirements 3.6 Socket Size The socket size must meet the dimensions as shown in Figure A-5 and Figure A-6, allowing full insertion of the pins in the socket, without interference between the socket and the pin field. The mPGA604 socket and actuation area must fit within the keep-in zone defined in Figure A-6. 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated package pin field displacement will not exceed 1.27 mm. Movement
Streszczenie treści zawartej na stronie nr. 16
R Mechanical Requirements 3.9.6 Lubricants For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are used elsewhere within the socket assembly, these lubricants must not be able to migrate to the socket contacts. 3.10 Material and Recycling Requirements Cadmium shall not be used in the painting or plating of the socket. CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must
Streszczenie treści zawartej na stronie nr. 17
R Mechanical Requirements 3.16 Critical-to-Function Dimensions The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric. Asymmetric features are designed to properly align the socket to the motherboard and prevent the socket from being assembled incorrectly to the motherboard. Critical-to-function (CTF) dimensions are identified in Table 3-1. The CTF values are detailed on the mPGA604 socket drawing in Figure A-5 and Figure A-6 and take precedence over a
Streszczenie treści zawartej na stronie nr. 18
R Mechanical Requirements This page intentionally left blank. 18 mPGA604 Socket Design Guidelines
Streszczenie treści zawartej na stronie nr. 19
R 4 Electrical Requirements Socket electrical requirements are measured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field. Table 4-1. Electrical Requirements for
Streszczenie treści zawartej na stronie nr. 20
R Electrical Requirements 4.1 Electrical Resistance Figure 4-1 and Figure 4-2 show the proposed methodology for measuring the final electrical resistance. The methodology requires measuring interposer flush-mounted directly to the motherboard fixtures, so that the pin shoulder is flush with the motherboard, to get the averaged jumper resistance, Rjumper. The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture. The same measur
