Streszczenie treści zawartej na stronie nr. 1
R
mPGA604 Socket
Mechanical Design Guide
March 2005
Document Number: 254239-002
Streszczenie treści zawartej na stronie nr. 2
R ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
Streszczenie treści zawartej na stronie nr. 3
R Contents 1 Introduction ....................................................................................................................... 7 1.1 Objective ................................................................................................................7 1.2 Purpose..................................................................................................................7 1.3 Scope................................................................................
Streszczenie treści zawartej na stronie nr. 4
R 5.2 Solvent Resistance ..............................................................................................28 5.3 Durability ..............................................................................................................28 6 Validation Testing Requirements.................................................................................. 29 6.1 Applicable Documents .........................................................................................29 6.2 T
Streszczenie treści zawartej na stronie nr. 5
R Revision History Revision Description Date Number 001 • Initial release of the document. October 2003 ® 002 • Updated for 2005 Intel Xeon™ products. March 2005 Note: Not all revisions may be published. mPGA604 Socket 5 Mechanical Design Guide
Streszczenie treści zawartej na stronie nr. 6
R Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented. Typical examples of significant changes include, but are not limited to, the following: plastic
Streszczenie treści zawartej na stronie nr. 7
R 1 Introduction 1.1 Objective This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604 Socket contacts have 1.27mm pitch with regular pin array, to mate with a 604
Streszczenie treści zawartej na stronie nr. 8
R Introduction 8 mPGA604 Socket Mechanical Design Guide
Streszczenie treści zawartej na stronie nr. 9
R 2 Assembled Component and Package Description The mPGA604 socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using flip-chip pin grid array (FC- mPGA4) package technology are targeted to be used with the mPGA604 socket. The assembled component may consist of a cooling solution (heatsink, fan, and retention mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines docume
Streszczenie treści zawartej na stronie nr. 10
R Assembled Component and Package Description 10 mPGA604 Socket Mechanical Design Guide
Streszczenie treści zawartej na stronie nr. 11
R 3 Mechanical Requirements 3.1 Attachment A retention system needs to isolate any load in excess of 222.41 N, compressive, from the socket during the shock and vibration conditions outlined in Section 5. The socket must pass the mechanical shock and vibration requirements listed in Section 5 with the associated heatsink and retention mechanism attached. Socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive....) methods to a
Streszczenie treści zawartej na stronie nr. 12
R Mechanical Requirements 3.5 Markings All markings required in this section must be able to withstand a temperature of 240 ºC for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5. 3.5.1 Name mPGA604 (Font type is Helvetica Bold – minimum 6 point). This mark shall be molded or Laser Marked into the processor side of the socket housing. Manufacturer’s insignia (font size at supplie
Streszczenie treści zawartej na stronie nr. 13
R Mechanical Requirements 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated package pin field displacement will not exceed 1.27 mm. Movement will be along the Y direction. No Z-axis travel (lift out) of the package is allowed during actuation. 3.8 Orientation in Packaging, Shipping and Handling Packaging media needs to support high volume manufacturing. 3.9 Contact Characteristics 3.9.1 Number of contacts Total number of contacts: 603
Streszczenie treści zawartej na stronie nr. 14
R Mechanical Requirements CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines. 3.11 Lever Actuation Requirements • Lever closed direction—right. • Actuation direction called out in Section 9. • 135º lever travel max. • Pivot point in the center of the actuation area on the top of the socket. Section 9. 3.12 Socket Engagement/Disengagement F
Streszczenie treści zawartej na stronie nr. 15
R Mechanical Requirements maintain Critical Process Parameters controlling these CTFs or will provide direct measurements to meet ongoing quality requirements. Table 3-1. Package Critical-To-Function (CTF) Dimensions Dimension Socket Length Socket Width Socket Height (Interposer surface from MB) Assembled Seating Plane Flatness Ball Diameter True Position of Balls (pattern relating) Co-planarity (profile) of Balls Actuation Distance (Cover Travel) Through Cavity X Through Cavit
Streszczenie treści zawartej na stronie nr. 16
R Mechanical Requirements 16 mPGA604 Socket Mechanical Design Guide
Streszczenie treści zawartej na stronie nr. 17
R 4 Electrical Requirements Socket electrical requirements are measured from the socked-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specification are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field. Table 4-1. Electric al Requirements for
Streszczenie treści zawartej na stronie nr. 18
R Electrical Requirements Table 4-2. Definitions (Sheet 2 of 2) 4 Maximum Average Contact The max average resistance target is originally Resistance. Refer to Table 4-1, derived from max resistance of each chain Item 4 minus resistance of shorting bars divided by number of pins in the daisy chain. This value has to be satisfied at all time. Thus, this is the spec valid at End of Line, End of Life and etc. Socket Contact Resistance: The resistance of the socket contact, interface resi
Streszczenie treści zawartej na stronie nr. 19
R Electrical Requirements Figure 4-3 shows the resistance test fixtures separately and superimposed. The upper figure is the package. The next figure is the baseboard. There are 48 daisy chain configurations on resistance test board. The bottom figure is the two parts superimposed. Table 4-3 shows these configurations with the number of pins per each chain and netlist. Figure 4-3. Electrical Res istance Fixtures Superimposed mPGA604 Socket 19 Mechanical Design Guide
Streszczenie treści zawartej na stronie nr. 20
R Electrical Requirements 20 mPGA604 Socket Mechanical Design Guide
