Manual de instrucciones de Delta Electronics FHS-A7015B40

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FHS-A7015A40/FHS-A7015B40
Application:

Intel Socket 478 Prescott FMB1.5
Thermal & Mechanical Specification:
o

Thermal resistance: 0.28 C/W (ref.)

Heatsink Weight: 370 g (ref.)

Clipping Force: 32.0 Kgf (ref.)
Component Specification:

Heat Sink
Noise (dBA) Thermal Resistance
Type: Thermal Shrink
45
0.38
Material: Fin-Aluminum 6063 or Equivalent.
Core-Copper C1100 or Equivalent.
0.36
40
Dimension: 93.5 x 68.5 x 41.2 mm
0.34

Thermal interface material
35
Material: Dow Corning SC102 or Eq

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FHS-A7015A41/FHS-A7015B41 Application:
AMD Socket 754 K8 (Athlon 64) Thermal & Mechanical Specification: o
Thermal resistance: 0.26 C/W (ref.)
Heatsink Weight: 350 g (ref,)
Clipping Force: 32.0 Kgf (ref.) Component Specification:
Heat Sink Noise (dBA) Thermal Resistance Type: Soldering Heat Sink 0.340 Material: Fin-Aluminum 6063 or Equivalent. 45.0000 0.330 Base- Copper C1100 0.320 Dimension: 77 x 68.5 x 41.2 mm 40.0000
Thermal interface material 0.310 Material: Dow Corning SC102 or

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FHS-A7015A42/FHS-A7015B42 Application:
AMD Socket 754 K8 (Athlon 64) Thermal & Mechanical Specification: o
Thermal resistance: 0.28 C/W (ref.)
Heatsink Weight: 290 g (ref,)
Clipping Force: 32.0 Kgf (ref.) Component Specification:
Heat sink Noise (dBA) Thermal Resistance . Type: Extrusion 0.360 45 Material: Aluminum 6063 or Equivalent. 0.350 Dimension: 77xx 68.5 41.2 mm
Thermal interface material 40 0.340 Material: Dow Corning SC102 or Equivalent. 0.330
Fan(70x70x15mm) 35 Life Time:

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FHS-A7025A04/FHS-A7025B04 Tool-Free Clip Application:
Intel Socket 478 Prescott FMB1.5 Thermal & Mechanical Specification: o
Thermal resistance: 0.28 C/W (ref.)
Heatsink Weight: 350 g (ref.)
Clipping Force: 32.0 Kgf (ref.) Component Specification:
Heat Sink Thermal Resistance Noise (dBA) Type: Soldering Heat Sink 0.38 50 Material: Fin-Aluminum 6063 or Equivalent. Base-Copper C1100 or Equivalent. 0.36 45 Dimension: 93.5xx 68.5 41.2 mm
Thermal interface material 0.34 40 Material: Dow C

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FHS-A9025A00 Application:
Intel Socket 775 Prescott FMB2.0 Thermal & Mechanical Specification: o
Thermal resistance: 0.25 C/W (ref.)
Heatsink Weight: 380 g (ref.)
Clipping Force: 20.0 Kgf (ref.) Component Specification:
Heat Sink Noise (dBA) Thermal Resistance Type: Thermal Shrink 0.320 50.0 Material: Fin-Aluminum 6063 or Equivalent. 0.310 Core-Copper C1100 or Equivalent. Dimension: 90xx 90 32 mm 45.0 0.300
Thermal interface material 0.290 Material: Dow Corning SC102 or Equivalent. 0