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Intel Q965 Express Chipset
Development Kit User Manual
October 2007
Order Number: 315664-002US
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Legal Lines and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS
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Intel Q965 Express Chipset— Contents 1.0 About This Manual .................................................................................................... 7 1.1 Content Overview ............................................................................................... 7 1.2 Text Conventions................................................................................................ 7 1.3 Glossary of Terms and Acronyms .................................................................
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—Intel Q965 Express Chipset 4.6.1 Installation of a new Operating System ..................................................... 45 4.6.2 Drivers Installation ................................................................................. 45 5.0 Error Messages and Beep Codes .............................................................................. 46 5.1 Speaker ........................................................................................................... 46 5.2 BIOS Beep Codes
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Intel Q965 Express Chipset— 23 Beep codes..............................................................................................................46 24 Lists of error messages and brief description of each .....................................................47 25 Port 80h POST Code Ranges ......................................................................................47 26 Port 80h Progress Code Enumeration ..........................................................................48
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—Intel Q965 Express Chipset Revision History Date Revision Description Change SDVOB to SDVOC in pins 58, 59, 62 and 63 in Table 9, “Intel® SDVO to PCI Express* October 2007 002 connector mapping for MEC cards” on page 18. October 2006 001 Initial public release. ® Intel Q965 Express Chipset October 2007 DM 315664-002US 6
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Intel Q965 Express Chipset—About This Manual 1.0 About This Manual ® ® This user’s manual describes the use of the Intel Q965 Express Chipset Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. All jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes, are defined in this document. ® ® For the latest information about the Intel Q965 Express Chipset Development Kit reference platf
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About This Manual—Intel Q965 Express Chipset Variables Variables are shown in italics. Variables must be replaced with correct values. Instructions Instruction mnemonics are shown in uppercase. When you are programming, instructions are not case-sensitive. You may use either upper-case or lower-case. Numbers Hexadecimal numbers are represented by a string of hexadecimal digits followed by the character H. A zero prefix is added to numbers that begin with A through F. (For example, FF is sh
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Intel Q965 Express Chipset—About This Manual Table 1. Glossary of Terms and Acronyms (Sheet 1 of 3) Term Description Advanced Digital Display Card – second Generation. This card provides digital display options for an Intel Graphics Controller. It plugs into an x16 PCI Express* connector but ADD2 Card uses the multiplexed SDVO interface. This Advanced Digital Display Card will not work with an Intel Graphics Controller that supports DVO and ADD cards. ACPI Advanced Configuration and Power In
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About This Manual—Intel Q965 Express Chipset Table 1. Glossary of Terms and Acronyms (Sheet 2 of 3) Term Description Intel® Virtualization Technology. Intel® VT allows one hardware platform to function as 1 ® multiple “virtual” platforms. For businesses, Intel VT Technology (Intel VT) offers ® Intel VT improved manageability, limiting downtime and maintaining worker productivity by isolating computing activities into separate partitions. Intel® Wide Improves execution speed and efficiency, d
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Intel Q965 Express Chipset—About This Manual Table 1. Glossary of Terms and Acronyms (Sheet 3 of 3) Term Description A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM Rank devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a single side of a DIMM. Unified Memory Architecture. Describes an IGD using system memory for its frame UMA buffers. Note: ® ® ® 1. Intel Virtualization Technology (Intel VT), and Intel 64 Architectur
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Development Kit Hardware Features—Intel Q965 Express Chipset 2.0 Development Kit Hardware Features 2.1 Overview This chapter provides information on the development kit features and the board capability. For detailed platform features please refer to the Platform Design Guide for ® or datasheet for the chipset and the Intel Core™2 Duo processor Thermal and Mechanical Design Guidelines. ® ® 2.2 Intel Q965 Express Chipset Development Kit Features Summary This section summarizes the developmen
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Intel Q965 Express Chipset—Development Kit Hardware Features Table 3. Development Kit Features Summary (Sheet 2 of 2) Form Factor 4 Layer μBTX (10.5 inches x 10.4 inches) Six SATA 1.5/3.0 Gb/s ports. Ten Universal Serial Bus (USB) 2.0 ports – Three front panel headers for support of six front panel ports and four back panel ports Three 1394a PCI controller – 2 front headers for support of two ports and one back panel port (Disabled in this Development Kit) Peripheral PS/2-style keyboard and
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Development Kit Hardware Features—Intel Q965 Express Chipset Figure 1. Dev Kit Board Main Components, Headers and Jumper Locations 2.3.1 Core Components Table 4. Core Components Reference Component Description Designator J1PR LGA775 processor socket ® U1UB Intel Q965 (G)MCH ® U1LB Intel ICH8DO ® U1LN Intel 82566DM Gb LAN chip U1CK Clock Generator CK505 U1LH Super I/O (Port Angles) U1AU Audio Codec U2LB Primary SPI Flash (stuffed with 16 Mb) Note: There will be 2 SPI footprints on the board. Fir
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Intel Q965 Express Chipset—Development Kit Hardware Features 2.3.2 Jumper Settings and Descriptions Table 5. Jumper Settings Jumper Default Description Notes 1-2 = Normal J7LB 1-2 BIOS Config/Recovery 2-3 = Config Mode Off = Recovery 1-2 = Normal J6LB 1-2 Clear CMOS 2-3 = Clear CMOS 1-2 = Normal J8LH 1-2 Power-On Forcing 2-3 = Force On (Sets CPU presence bit; may not always force board power on) 2.3.3 LED Descriptions Power LEDs are on the board to indicate when standby and core power is
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Development Kit Hardware Features—Intel Q965 Express Chipset Table 7. Header and Connector Descriptions (Sheet 2 of 2) Header Description Notes J22LB SATA connector SATA HDD port 1 J23LB SATA connector SATA HDD port 2 J21LB SATA connector SATA HDD port 3 J19LB SATA connector SATA HDD port 4 J20LB SATA connector SATA HDD port 5 J1MY DIMM connector Channel A DIMM 0 J2MY DIMM connector Channel A DIMM 1 J3MY DIMM connector Channel B DIMM 0 J4MY DIMM connector Channel B DIMM 1 J4LH Floppy c
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Intel Q965 Express Chipset—Development Kit Hardware Features Figure 2. Rear Panel I/O Connectors E E K K O O A A I I H H J J P P D D G G L L M M N N BC BC F F Table 8. Back panel connectors Callouts from Designator Description Figure 2.2 A J5LH PS/2 mouse port [Green] B J5LH PS/2 keyboard port [Purple] C J1AU S/PDIF Digital audio output D J2AU S/PDIF Digital audio input E J6LH Parallel port [Burgundy] FJ4UB VGA Port Back Panel USB Ports 1 and 2 GJ17LB Overlapping with 1394(J3FW) H JA1LN RJ45 LA
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Development Kit Hardware Features—Intel Q965 Express Chipset Table 9. Intel® SDVO to PCI Express* connector mapping for MEC cards (Sheet 1 of 3) Pin Side B Side A Number PCI Express* PCI Express* SDVO/MEC Function SDVO/MEC Function Function Function 1 12 V 12 V PRSNT1# NC 2 12 V 12 V 12V 12V 3 RSVD RSVD 12V 12V 4 GND GND GND GND 5SMCLK NC JTAG2 (TCK) NC 6 SMDAT NC JTAG3 (TDI) JTAG3 (TDI) 7 GND GND JTAG4 (TDO) JTAG4 (TDO) 83.3 V 3.3 V JTAG5 (TMS) NC 9JTAG1 (TRST#) NC 3.3 V 3.3 V 10 3.3 Vaux 3.3
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Intel Q965 Express Chipset—Development Kit Hardware Features Table 9. Intel® SDVO to PCI Express* connector mapping for MEC cards (Sheet 2 of 3) Pin Side B Side A Number 34 PET4-(or PETn4) NC GND GND 35 GND GND PER4+(or PERp4) NC 36 GND GND PER4-(or PERn4) NC 37 PET5+(or PETp5) NC GND GND 38 PET5-(or PETn5) NC GND GND 39 GND GND PER5+(or PERp5) NC 40 GND GND PER5-(or PERn5) NC 41 PET6+(or PETp6) NC GND GND 42 PET6-(or PETn6) NC GND GND 43 GND GND PER6+(or PERp6) NC 44 GND GND PER6-(or PERn6) NC
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Development Kit Hardware Features—Intel Q965 Express Chipset Table 9. Intel® SDVO to PCI Express* connector mapping for MEC cards (Sheet 3 of 3) Pin Side B Side A Number PER12-(or 69 GND GND NC PERn12) 70 PET13+(or PETp13) SDVOB_Blue+ GND GND 71 PET13-(or PETn13) SDVOB_Blue- GND GND PER13+(or 72 GND GND NC PERp13) PER13-(or 73 GND GND NC PERn13) 74 PET14+(or PETp14) SDVOB_Green+ GND GND 75 PET14-(or PETn14) SDVOB_Green- GND GND PER14+(or 76 GND GND NC PERp14) PER14-(or 77 GND GND NC PERn14
