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FEATURES
High efficiency: 87% @5.0V/3A
Size: 27.9x24.4x8.3mm (1.1”x0.96”x0.33”)
Industry standard 1x2 pinout
SMT and Through-hole versions
2:1 input voltage range
Input UVLO, Output OCP, OVP and OTP
Monotonic startup into normal and pre-bias
loads
Output voltage trim ±10%
2250V isolation and basic insulation
No minimum load required
ISO 9001, TL 9000, ISO 14001, QS 9000,
OHSAS 18001 certified manufacturing facility
UL/cUL 60950 (US & Canada) Recognized,
and TUV (EN60950
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TECHNICAL SPECIFICATIONS T = 25°C, airflow rate = 300 LFM, V = 48 Vdc, nominal Vout unless otherwise noted. A in PARAMETER NOTES and CONDITIONS S48SE05003 (Standard) Min. Typ. Max. Units ABSOLUTE MAXIMUM RATINGS Input Voltage Continuous 80 Vdc Transient(100ms) 100ms 100 Vdc Operating Temperature Refer to Figure 20 for measuring point -40 109 °C Storage Temperature -55 125 °C Input/Output Isolation Voltage 2250 Vdc INPUT CHARACTERISTICS Operating Input
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ELECTRICAL CHARACTERISTICS CURVES 90 2.8 85 2.4 80 2 75Vin 75 48Vin 1.6 75Vin 70 36Vin 1.2 65 48Vin 0.8 60 36Vin 55 0.4 50 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 1: Efficiency vs. load current for minimum, nominal, and Figure 2: Power dissipation vs. load current for minimum, nominal, maximum input voltage at 25°C. and maximum input voltage at 25°C. 0.6 0.5 0.4 0.3 0.2 0.1 0 30 35 40 45 50 55 60 65 70 75 INPU
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ELECTRICAL CHARACTERISTICS CURVES (CON.) Figure 8: Output voltage response to step-change in load current Figure 7: (For positive remote on/off logic)Turn-on transient at zero (75%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum load current (5 ms/div). Vin=48V. Top Trace: Vout, 2V/div; Bottom capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 200us/div), Bottom Trace: Iout (1A/div). Scope measurement Trace: ON/OFF input, 2V/div. should be made using a
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ELECTRICAL CHARACTERISTICS CURVES Figure 11: Input Terminal Ripple Current, i , at full rated output Figure 12: Input reflected ripple current, i , through a 12µH source c s current and nominal input voltage with 12µH source impedance and inductor at nominal input voltage and rated load current (20 33µF electrolytic capacitor (200mA/div, 1us/div) mA/div, 1us/div) Copper Strip Vo(+) SCOPE RESISTIV 10u 1u LOAD Vo(-) Figure 13: Output voltage noise and ripple measurement test setup Fi
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DESIGN CONSIDERATIONS The input source must be insulated from the ac Input Source Impedance mains by reinforced or double insulation. The impedance of the input source connecting to the The input terminals of the module are not operator DC/DC power modules will interact with the modules accessible. and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than If the metal baseplate is grounded, one Vi pin and a few µH,
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FEATURES DESCRIPTIONS Remote On/Off Over-Current Protection The remote on/off feature on the module can be either The modules include an internal output over-current negative or positive logic. Negative logic turns the module protection circuit, which will endure current limiting for on during a logic low and off during a logic high. Positive an unlimited duration during output overload. If the logic turns the modules on during a logic high and off output current excee
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FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment ON/OFF ON/OFF Vo Vo (- (-) ) To increase or decrease the output voltage set point, R R tr triim m- -u up p the modules may be connected with an external Vi (-) Vi (-) Trim Trim R R resistor between the TRIM pin and either the Vo(+) or Loa Load d Vo(-). The TRIM pin should be left open if this feature is not used. Vi (+) Vi (+) Vo Vo (+ (+) ) V V Vo o o (-) (-) (-) Figure 18: Circuit configuration for trim-up (increase o
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THERMAL CONSIDERATIONS Thermal Derating Thermal management is an important part of the system Heat can be removed by increasing airflow over the design. To ensure proper, reliable operation, sufficient module. To enhance system reliability, the power module cooling of the power module is needed over the entire should always be operated below the maximum temperature range of the module. Convection cooling is operating temperature. If the temperature exceeds the usually the dominant
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PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) DS_S48SE05003_12292006 10
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LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE Peak temp. 2nd Ramp-up temp. 210~230°C 5sec. 1.0~3.0°C /sec. 250 Pre-heat temp. 140~180°C 60~120 sec. 200 Cooling down rate <3°C /sec. Ramp-up temp. 150 0.5~3.0°C /sec. 100 Over 200°C 40~50sec. 50 0 1 60 20 180 240 300 Time ( sec. ) Note: The temperature refers to the pin of S48SE, measured on the pin +Vout joint. LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE Temp. Peak Temp. 240 ~ 245 ℃ 217℃ Ramp down max. 4 ℃/sec. ℃ 20
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MECHANICAL DRAWING Surface-mount module Through-hole module Pin No. Name Function 1 +Vin Positive input voltage 2 -Vin Negative input voltage 3 ON/OFF (Optional) Remote ON/OFF (Optional) 4 -Vout Negative output voltage 5 TRIM (Optional) Output voltage trim (Optional) 6 +Vout Positive output voltage DS_S48SE05003_12292006 12
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PART NUMBERING SYSTEM S 48 S E 050 03 N R F A Product Input Number of Product Output Output ON/OFF Pin Option Code Type Voltage Outputs Series Voltage Current Logic Length/Type F- RoHS 6/6 S - Small 48V- S - Single 1x1, 5A 050 – 5.0V 03 - 3A N - Negative R - 0.170” A - No trim pin Power 36V~75V P - Positive N - 0.145” (Lead Free) B - With trim pin E - No K - 0.110” remote M - SMD on/off control pin MODEL LIST MODEL NAME INPUT OUTPUT EFF @ 100% LOAD S48SE1R805NRFA 36V~75V 0
