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INTEGRATED CIRCUITS
DATA SHEET
TDA2613
6 W hi-fi audio power amplifier
July 1994
Product specification
File under Integrated circuits, IC01
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 GENERAL DESCRIPTION The TDA2613 is a hi-fi audio power amplifier encapsulated in a 9-lead SIL plastic power package. The device is especially designed for mains fed applications (e.g. tv and radio). Features • Requires very few external components • Input muted during power-on and off (no switch-on or switch-off clicks) • Low offset voltage between output and ground • Hi-fi according to IEC 268 and DIN 45500 • Shor
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Fig.1 Block diagram. PINNING 1. n.c. not connected ground (asymmetrical) or 5. GND 2. n.c. not connected negative supply (symmetrical) 1 ⁄ V (asymmetrical) or 6. OUT output 2 P 3. V /2 P ground (symmetrical) 7. +V positive supply P 4. n.c. not connected 8. INV inverting input 9. - INV non-inverting input July 1994 3
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 FUNCTIONAL DESCRIPTION This hi-fi power amplifier is designed for mains fed applications. The device is intended for asymmetrical power supplies, but a symmetrical supply may also be used. An output power of 6 watts (THD = 0,5%) can be delivered into an 8 Ω load with an asymmetrical power supply of 24 V. The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread. A special feature of this dev
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Fig.2 Power derating curve. THERMAL RESISTANCE From junction to case R = 8 K/W th j-c HEATSINK DESIGN EXAMPLE With derating of 8 K/W, the value of heatsink thermal resistance is calculated as follows: given R = 8 Ω and V = 24 V, the measured maximum dissipation is 4,1 W; then, for a maximum ambient temperature L P of 60 °C, the required thermal resistance of the heatsink is: 150 – 60 R = –81 ≈ 4K/W ---------------
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 CHARACTERISTICS PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating mode V 15 24 42 V P input mute mode V 4 - 10 V P Repetitive peak output current I 2.2 -- A ORM Operating mode: asymmetrical power supply; test circuit as per Fig.4; V = 24 V; R = 8 Ω; T = 25 °C; f = 1 kHz P L amb Total quiescent current I 10 20 35 mA tot Output power THD = 0,5% P 56 - W o THD = 10% P 6,5 8,0 - W o Tot
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Operating mode: symmetrical power supply; test circuit as per Fig.3; V = ± 12 V; R = 8 Ω; T = 25 °C; f = 1 kHz P L amb Total quiescent current I 10 20 35 mA tot Output power THD = 0,5% P 56 - W o THD = 10% P 6,5 8,5 - W o Total harmonic distortion P = 4 W THD - 0,13 0,2 % o Power bandwidth THD = 0,5% note 1 B - 40 to 16 k - Hz Voltage gain G 29 30 31 dB v Noise outpu
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 APPLICATION INFORMATION Fig.3 Test and application circuit; symmetrical power supply. Fig.4 Test and application circuit; asymmetrical power supply. July 1994 8
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 Input mute circuit 1 The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the ⁄ supply 2 voltage (at pin 3) with an internally fixed reference voltage (V ), derived directly from the supply voltage. When the ref voltage at pin 3 is lower than V the non-inverting input (pin 9) is disconnected from the amplifier. The voltage at pin 3 ref is determined by an inte
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1 D D 1 q A P P 2 1 A 3 q 2 q 1 A A 4 E pin 1 index c L 19 b Z e Q b w M 2 b 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) A 2 Z (1) (1) UNIT A Abc b b D D E eL P P Q q q q w A 3 4 1 2 1 1 1 2 max. max. 18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 3.9 2.75 3.4 1.75 15.1 4.4 5.9 2.54 mm 3.7 0.25 1.0
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Philips Semiconductors Product specification 6 W hi-fi audio power amplifier TDA2613 SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (T ). If the stg max printed-circuit board has been pre-heated, forced cooling There is no soldering method that is ideal for all IC may be necessary immediately after soldering to keep the packages. Wave soldering is often preferred when tempera
