Instruction d'utilisation SMSC SCH5027E

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SCH5027E
Super I/O with
Temperature Sensing,
Quiet Auto Fan and
Glue Logic with PECI
Data Brief
PRODUCT FEATURES
General Features Infrared Port
— 3.3 Volt Operation (SIO Block is 5 Volt Tolerant) — Multiprotocol Infrared Interface
—LPC Interface — IrDA 1.0 Compliant
— Programmable Wake-up Event Interface — SHARP ASK IR
— PC99, PC2001 Compliant — 480 Addresses, Up to 15 IRQ
— ACPI 2.0 Compliant
Multi-Mode™ Parallel Port with ChiProtect™
— Multiplexed Command, Address and Data Bus
— Standa

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Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI Temperature Monitor — Monitoring of Two Remote Thermal Diodes — Processor temperature monitoring by PECI — Internal Ambient Temperature Measurement — Limit Comparison of all Monitored Values — Interrupt Pin for out-of-limit Temperature Indication — Thermal events generate PME’s — Configurable offset for internal or external temperature channels. Voltage Monitor — Monitor Power supplies (2 at 1.125V, one at 5V, one

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Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI General Description The SCH5027E is a 3.3V (Super I/O Block is 5V tolerant) PC99/PC2001 compliant Super I/O controller with an LPC interface. SCH5027E also includes Hardware Monitoring capabilities, enhanced Security features, Power Control logic and Motherboard Glue logic. The SCH5027E's hardware monitoring capability includes temperature, voltage and fan speed monitoring. It has the ability to alert the system to out

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Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI Block Diagram WDT* CLK32 WDT CLOCK LEDs CLOCKI GEN PD[7,0] Multi-Mode SER_IRQ SERIAL Parallel Port BUSY, SLCT, PE, PCI_CLK IRQ with nERROR, nACK TM ChiProtect / nSTROBE, nINIT, FDC MUX nSLCTIN, nALF LAD[3:0] Internal Bus LPC (see LPC47B27x) (Data, Address, and Control lines) Bus Interface LFrame# TXD1*, RXD1 LDRQ# High-Speed nCTS1, nRTS1* 16550A PCI_RESET# UART nDSR1, nDTR1 PORT 1 nDCD1, nRI1 IO_PME_S3* IO_PME_S5

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Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic with PECI Chapter 2 Package Outline Figure 3 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint Table 1 128 Pin QFP Package Parameters MIN NOMINAL MAX REMARKS A ~ ~ 3.4 Overall Package Height A1 0.05 ~ 0.5 Standoff A2 2.55 ~ 3.05 Body Thickness D 23.00 23.20 23.40 X Span D1 19.90 20.00 20.10 X body Size E 17.00 17.20 17.40 Y Span E1 13.90 14.00 14.10 Y body Size H 0.09 ~ 0.20 Lead Frame Thickness L 0.73 0.88 1.03 Lea