ページ1に含まれる内容の要旨
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D188
BGY148A; BGY148B
HF amplifier modules
1998 May 13
Product specification
Supersedes data of 1997 Jul 14
ページ2に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B FEATURES PINNING - SOT421A • Single 6 V nominal supply voltage PIN DESCRIPTION • 3 W output power 1 RF input • Easy control of output power by DC voltage 2V C • Silicon bipolar technology 3V S • Standby current less than 100 μA. 4 RF output Flange ground APPLICATIONS • Portable communication equipment operating in the 400 to 440 MHz and 430 to 488 MHz frequency ranges handbook, halfpage respectively. DESCRIPTION The
ページ3に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B CHARACTERISTICS Z =Z =50 Ω;P = 10 mW; V = 6 V; V ≤ 3.5 V; T =25 °C; unless otherwise specified. S L D S C mb SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range BGY148A 400 - 440 MHz BGY148B 430 - 488 MHz I total quiescent current V = 0; P =0 -- 100 μA Q C D I control current adjust V for P =3W -- 500 μA C C L P load power 3 -- W L G power gain adjust V for P = 3 W 24.8 -- dB p C L η efficiency adjust V
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Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD553 MGD554 5 60 handbook, halfpage handbook, halfpage P L η (W) 400 MHz (%) 4 440 MHz 440 MHz 400 MHz 40 3 2 20 1 0 0 01 2 3 4 0 12 3 4 P (W) V (V) C L Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. S L D S mb S L D S mb Fig.3 Load power as a function of control voltage; Fig.4 Efficiency as a function of load power; BGY148A; typical values. BGY148A; typical values. MGD555 MGD5
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Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD557 MGD558 4 - 30 3.0 handbook, halfpage V C VSWR H H in 2, 3 (V) (dBc) 2.5 3 - 40 H VSWR 3 in 2 2.0 H V 2 C - 50 1 1.5 0 1.0 - 60 380 400 420 440 380 400 420 440 460 460 f (MHz) f (MHz) Z =Z =50 Ω; P = 10 mW; V = 6 V; P = 3 W; T =25 °C. Z =Z =50 Ω; P = 2 mW; V = 4.8 V; P = 3 W; T =25 °C. S L D S L mb S L D S L mb Fig.7 Control voltage and input VSWR as functions Fig.8 Harmonics as a function of frequency; of fre
ページ6に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD559 MGD560 5 60 handbook, halfpage handbook, halfpage P 430 MHz L η (W) (%) 4 430 MHz 488 MHz 40 488 MHz 3 2 20 1 0 0 01 2 3 4 0 12 3 4 P (W) V (V) C L Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. Z =Z =50 Ω; P = 10 mW; V = 6 V; T =25 °C. S L D S mb S L D S mb Fig.10 Load power as a function of control voltage; Fig.11 Efficiency as a function of load power; BGY148B; typical values. BGY148B; typical values. MGD561 MG
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Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B MGD563 MGD564 4 - 30 3.0 handbook, halfpage V H H C 2, 3 VSWR in (V) (dBc) 2.5 3 - 40 H 2 V C 2 2.0 - 50 H 3 VSWR in 1 1.5 - 60 0 1.0 - 70 420 420 440 460 480 500 440 460 480 500 f (MHz) f (MHz) Z =Z =50 Ω; P = 10 mW; V = 6 V; P = 3 W; T =25 °C. Z =Z =50 Ω; P = 2 mW; V = 4.8 V; P = 3 W; T =25 °C. S L D S L mb S L D S L mb Fig.14 Control voltage and input VSWR as functions Fig.15 Harmonics as a function of frequency;
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Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B SOLDERING The indicated temperatures are those at the solder MGM159 300 interfaces. handbook, halfpage Advised solder types are types with a liquidus less than or T equal to 210 °C. (°C) Solder dots or solder prints must be large enough to wet 200 the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitt
ページ9に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B 22.6 handbook, full pagewidth DETAIL 2 0.8 0.4 1.7 2 1.5 8.45 1 2.9 2.7 0.6 2.7 0.1 1.1 1.1 2.4 2.6 0.1 7.48 DETAIL 15.1 0.5 0.7 MGK391 20.18 footprint metallization solder area. 21.8 handbook, full pagewidth 2 0.8 2 2 7.05 1.7 3.2 2 1.8 7.08 14.7 MGK392 19.78 solder area. Dimensions in mm. Fig.18 SOT421A footprint. 1998 May 13 9
ページ10に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B PACKAGE OUTLINE Ceramic single-ended flat package; 4 in-line leads SOT421A U D A y Z E U 1 L Q 12 3 4 b wM c e d e e 1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b cD dE e e L Q U U wy Z 1 1 3.0 0.56 0.30 22.1 2.4 13.4 0.7 3.4 22.4 8.2 0.25 mm 5.08 7.62 0.25 0.15 2.6 0.46 0.20 21.7 2.0 13.0 0.3 3.0 22.0 7.8 0.05 REFERENCES OUTLINE EUROPEAN ISSUE DATE PROJECTION VERSION IEC JEDEC EIAJ SOT42
ページ11に含まれる内容の要旨
Philips Semiconductors Product specification HF amplifier modules BGY148A; BGY148B DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 1
ページ12に含まれる内容の要旨
Philips Semiconductors – a worldwide company Argentina: see South America Middle East: see Italy Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Tel. +31 40 27 82785, Fax. +31 40 27 88399 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Fax. +43 160 101 1210 Tel. +64 9 849 4160, Fax. +64 9 849 7811 Belarus: Hotel Min
