Omega Speaker Systems CY670 Seriesの取扱説明書

ページ1に含まれる内容の要旨

CY7/670 Series Temperature Sensors
Application Notes
M-4447/0307


An excessive heat flow through the connecting
INSTALLATION AND OPERATION
leads to any temperature sensor can create a
Three aspects of using a temperature sensor are
situation where the active sensing element (for the
critical to its optimum performance:
CY7/670 series this is the diode chip) is at a
• the proper electrical and thermal installation of
different temperature than the sample to which the
the connecti

ページ2に含まれる内容の要旨

Sensor Mounting A thin braze joint around the sides of the SD package is electrically connected to the sensing General Comments element. Contact to the sides with any electrically Before installing the CY7/670 series sensor, conductive material must be avoided. When identify which lead is the anode and which lead is viewed base down and with leads towards the the cathode by referring to the accompanying observer, the positive lead (anode) is on the right. device drawings. Be sure tha

ページ3に含まれる内容の要旨

CY7/670-LR 3. Lift the edge of the clip using a small pair of pliers or screwdriver. The gold-coated copper LR adapter is designed for insertion into a 1/8-inch diameter tube. A thin 4. Slide the SD package into place underneath layer of CYAG grease should be applied to the the clip and gently lower the clip onto the lid of copper adapter before insertion. This eases the SD package. Note that a slot is cut installation at room temperature and enhances the underneath the clip to accept the

ページ4に含まれる内容の要旨

REFERENCES Krause, J.K. and Swinehart, P.R. (1985). Demystifying Cryogenic Temperature Sensors. Photonics Spectra. August, 61–68. Krause, J.K. and Dodrill, B.C. (1986). Measurement System Induced Errors in Diode Thermometry. Review of Scientific Instruments 57 (4), 661–665. Sparks, L.L. (1983). Temperature, Strain, and Magnetic Field Measurements. In Material at Low Temperatures, Ed. By R.P. Reed and A.F. Clark. American Society of Metals, Metals Park, 515–571. White, G.K. (1979). Experime