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®
Intel 631xESB/632xESB I/O
Controller Hub for Embedded
Applications
Thermal and Mechanical Design Guidelines
February 2007
Order Number: 315263-001
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Legal Lines and Disclaimers INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS
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® Contents—Intel 6321ESB ICH Contents 1.0 Introduction..............................................................................................................5 1.1 Design Flow........................................................................................................5 1.2 Definition of Terms ..............................................................................................7 1.3 Reference Documents .....................................................................
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® Intel 6321ESB ICH—Revision History 15 Heat Sink Foam Gasket Drawing.................................................................................31 16 Torsional Clip Drawing ..............................................................................................32 Tables 1 Definition of Terms .................................................................................................... 7 2 Referenced Documents......................................................................
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® Introduction—Intel 6321ESB ICH 1.0 Introduction As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks. The goals of this document are to: • Outline the thermal and mechanical operating limits and specifications for the Intel® 6321ESB I/O Controller Hub. • Describe a referenc
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® Intel 6321ESB ICH—Introduction Figure 1. Thermal Design Process Step 1: Thermal Simulation Thermal Model Thermal Model User's Guide Step 2: Heatsink Selection Thermal Reference Mechanical Reference Step 3: Thermal Validation Thermal Testing Software Software User's Guide ® Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDG February 2007 6
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® Introduction—Intel 6321ESB ICH 1.2 Definition of Terms Table 1. Definition of Terms Term Definition Bond line thickness. Final settled thickness of the BLT thermal interface material after installation of heatsink. Flip Chip Ball Grid Array. A ball grid array packaging FCBGA technology where the die is exposed on the package substrate. The chipset component that integrates an Ultra ATA 100 controller, six Serial ATA host controller ports, one EHCI host controller supporting eight exter
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® Intel 6321ESB ICH—Introduction Table 2. Referenced Documents Title Location http://www.intel.com/design/ Intel® 631xESB / 632xESB I/O Controller Hub Datasheet chipsets/datashts/313082.htm http://www.intel.com/design/ Intel® 631xESB / 632xESB I/O Controller Hub Specification Update chipsets/specupdt/313075.htm Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Reference# 31307301 Design Guide Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI Hub (PXH/PXH- http://www.intel.com/design/
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® Packaging Technology—Intel 6321ESB ICH 2.0 Packaging Technology The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer FC-BGA3 package (see Figure 2 and Figure 3). Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View) Die Keepout Handling Area 19.49mm. Exclusion Area 10.78mm. 6.17mm. ESB2 20.19mm. 13.99mm. 26.0mm. 30.0mm. 40.0mm. Die 3.10mm. 26.0mm. 30.0mm. 40.0mm. Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View) Substrate
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® Intel 6321ESB ICH—Packaging Technology Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View) AT A R AP A N AM AL AK AJ A H AG AF AE A D A C AB AA 40 + 0.05 Y - A - W V U T R P N M L K 19.11 J H G F E D 35X 1.092 C B A A 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 1 3 5 7 9 11 13 15 17 19 21 23 25 2729 31 3335 35X 1.092 19.11 B 40 + 0.05 0.2 C A Notes: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M-1994. 3. Package Me
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® Thermal Specifications—Intel 6321ESB ICH 3.0 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O Controller Hub component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is refer
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® Intel 6321ESB ICH—Thermal Simulation 4.0 Thermal Simulation Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by Flomerics, Inc*. These m
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® Thermal Solution Requirements—Intel 6321ESB ICH 5.0 Thermal Solution Requirements 5.1 Characterizing the Thermal Solution Requirement The idea of a “thermal characterization parameter” Ψ (the Greek letter psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). The thermal characterization parameter is calculated using total package power, wherea
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® Intel 6321ESB ICH—Thermal Solution Requirements Figure 5. Processor Thermal Characterization Parameter Relationships T T A A Ψ Ψ SA SA HEATSINK Ψ Ψ CA CA TIM T T S S Ψ Ψ CS CS T T C C Device Example 1. Calculating the Required Thermal Performance The cooling performance, Ψ is defined using the thermal characterization parameter CA, previously described. The process to determine the required thermal performance to cool the device includes: 1. Define a target component tem
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® Thermal Solution Requirements—Intel 6321ESB ICH C Ψ== Ψ – Ψ 3.23–2 0.35=.88° --- - SA CA CS W If the local ambient temperature is relaxed to 45° C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance: T – T C LA 105 – 45 C Ψ== -- ----- ---- ---- -- - ---- ---- ---- - -= 4.84° -- - - CA TDP 12.4 W It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the case-to-ambient thermal resist
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® Intel 6321ESB ICH—Thermal Metrology 6.0 Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the Intel® 6321ESB I/O Controller Hub die temperatures. ® Section 6.1 provides guidelines on how to accurately measure the Intel 6321ESB ICH die temperatures. The flowchart in Figure 6 offers useful guidelines for thermal performance and evaluation.
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® Thermal Metrology—Intel 6321ESB ICH Figure 6. Thermal Solution Decision Flowchart Start Attach thermocouples Run the Power Attach device using recommended program and to board Tdie > metrology. Setup monitor the No using normal Specification? the system in the device die reflow desired temperature. process. configuration. End Select Heatsink Yes Heatsink Required 001240 Figure 7. Zero Degree Angle Attach Heatsink Modifications Note: Not to scale. ® Intel 631xESB/632xESB I/O Control
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® Intel 6321ESB ICH—Thermal Metrology Figure 8. Zero Degree Angle Attach Methodology (Top View) Die Thermocouple Wire Cement + Thermocouple Bead Substrate Note: Not to scale. ® Intel 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDG February 2007 18
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® Reference Thermal Solution—Intel 6321ESB ICH 7.0 Reference Thermal Solution Intel has developed one reference thermal solution to meet the cooling needs of the Intel® 6321ESB I/O Controller Hub component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Torsional Clip Heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset comp
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® Intel 6321ESB ICH—Reference Thermal Solution Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target at 65C Local-Ambient 8.000 7.000 Thermal Target 6.000 Simulation results with EOLife TIM performance 5.000 4.000 3.000 2.000 1.000 0.000 0 50 100 150 200 250 300 350 400 LFM through fin area 7.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width,
