Inhaltszusammenfassung zur Seite Nr. 1
P8H61-MX Series
• P8H61-MX R2.0
• P8H61-MX USB3
Motherboard
Inhaltszusammenfassung zur Seite Nr. 2
E7380 First Edition May 2012 Copyright © 2012 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1)
Inhaltszusammenfassung zur Seite Nr. 3
Contents Safety information ...................................................................................... vi About this guide ........................................................................................ vii P8H61-MX Series specifications summary .............................................. ix Chapter 1 Product introduction 1.1 Before you proceed ..................................................................... 1-1 1.2 Motherboard overview .............................
Inhaltszusammenfassung zur Seite Nr. 4
Contents Chapter 2 BIOS information 2.1 Managing and updating your BIOS ............................................ 2-1 2.1.1 ASUS Update utility ........................................................ 2-1 2.1.2 ASUS EZ Flash 2 ............................................................ 2-2 2.1.3 ASUS BIOS Updater ....................................................... 2-3 2.2 BIOS setup program .................................................................... 2-5 2.3 Main menu ...........
Inhaltszusammenfassung zur Seite Nr. 5
Contents 2.7 Boot menu .................................................................................. 2-25 2.7.1 Bootup NumLock State [On] ......................................... 2-25 2.7.2 Full Screen Logo [Enabled] ........................................... 2-25 2.7.3 Wait for ‘F1’ If Error [Enabled] ....................................... 2-25 2.7.4 Option ROM Messages [Force BIOS] ........................... 2-26 2.7.5 Setup Mode [EZ Mode] .............................................
Inhaltszusammenfassung zur Seite Nr. 6
Safety information Electrical safety • To prevent electric shock hazard, disconnect the power cable from the electric outlet before relocating the system. • When adding or removing devices to or from the system, ensure that the power cables for the devices are unplugged before the signal cables are connected. If possible, disconnect all power cables from the existing system before you add a device. • Before connecting or removing signal cables from the motherboard, ensure that all power cabl
Inhaltszusammenfassung zur Seite Nr. 7
About this guide This user guide contains the information you need when installing and configuring the motherboard. How this guide is organized This guide contains the following parts: • Chapter 1: Product introduction This chapter describes the supported features of the motherboard. • Chapter 2: BIOS information This chapter provides a detailed guide to navigating and setting up the BIOS. Conventions used in this guide To ensure that you perform certain tasks properly, take note of the follo
Inhaltszusammenfassung zur Seite Nr. 8
Where to find more information Refer to the following sources for additional information and for product and software updates. 1. ASUS websites The ASUS website provides updated information on ASUS hardware and software products. Refer to the ASUS contact information. 2. Optional documentation Your product package may include optional documentation, such as warranty flyers, that may have been added by your dealer. These documents are not part of the standard package. Typography Bold text I
Inhaltszusammenfassung zur Seite Nr. 9
P8H61-MX Series specifications summary ® rd nd CPU LGA1155 socket for Intel 3 /2 Generation Core™ i7 / i5 / i3 / ® ® Pentium / Celeron processors Supports 22/32nm CPU ® *Refer to www.asus.com for Intel CPU support list. ® Chipset Intel H61 Express Chipset Memory 2 x DIMMs, max. 16GB DDR3 2200 (O.C.) / 2133 (O.C.) / 2000 (O.C.) / 1866 (O.C.) / 1600 / 1333 / 1066 MHz, non-ECC, un- buffered memory* Dual-channel memory architecture ® *When you install memory of 4GB capacity or more, Windows 32-b
Inhaltszusammenfassung zur Seite Nr. 10
P8H61-MX Series specifications summary ASUS unique features ASUS MyLogo 2™ ASUS Anti-Surge Protection ASUS UEFI BIOS ASUS EZ Flash 2 ASUS FanXpert ASUS AI Charger (P8H61-MX R2.0 only) ASUS AI Charger+ (P8H61-MX USB3 only) ASUS Q-Fan 2 ASUS CrashFree BIOS 3 ASUS GPU Boost Rear panel ports 1 x PS/2 keyboard / mouse combo port 1 x DVI port 1 x D-Sub port 1 x LAN (RJ-45) port P8H61-MX R2.0: - 6 x USB 2.0/1.1 ports P8H61-MX USB3: - 4 x USB 2.0/1.1 ports - 2 x USB 3.0 ports 3 x Audio jacks Internal co
Inhaltszusammenfassung zur Seite Nr. 11
Chapter 1 Product introduction ® Thank you for buying an ASUS P8H61-MX Series motherboard! Before you start installing the motherboard and adding hardware components, check the items in your motherboard package. Refer to page x for the list of included accessories. • If any of the items is damaged or missing, contact your retailer. • ASUS P8H61-MX Series motherboards include P8H61-MX R2.0 and P8H61-MX USB3 models. The layout varies between the two models. The layout illustrations in this u
Inhaltszusammenfassung zur Seite Nr. 12
1.2 Motherboard overview Before you install the motherboard, study the configuration of your chassis to ensure that the motherboard fits. Unplug the power cord before installing or removing the motherboard. Failure to do so can cause you physical injury and damage motherboard components. 1.2.1 Placement direction When installing the motherboard, place it into the chassis in the correct orientation. The edge with external ports goes to the rear part of the chassis as indicated in the image be
Inhaltszusammenfassung zur Seite Nr. 13
LGA1155 CLRTC 1.2.3 Motherboard layout 1 2 3 1 4 18.3cm(7.2in) KB_USB56 CPU_FAN ATX12V USB34 LAN_USB12 2 AUDIO P8H61-MX R2.0 CHA_FAN PCIEX16 RTL 8111F Lithium Cell CMOS Power ® Super Intel 64Mb BIOS I/O PCIEX1_1 H61 SATA3G_3 SATA3G_1 PCIEX1_2 VIA VT1708S SB_PWR SPEAKER 5 USB910 USB78 SATA3G_4 SATA3G_2 AAFP F_PANEL 11 10 9 8 7 6 Chapter 1: Product introduction 1-3 VGA DVI DDR3 DIMM_A1 (64bit, 240-pin module) DDR3 DIMM_B1 (64bit, 240-pin module) EATXPWR 24.4cm(9.6in)
Inhaltszusammenfassung zur Seite Nr. 14
LGA1155 CLRTC 1 2 3 1 4 18.3cm(7.2in) KB_USB56 CPU_FAN ATX12V USB3_12 LAN_USB12 ASM 1042 2 AUDIO P8H61-MX USB3 CHA_FAN PCIEX16 RTL 8111F Lithium Cell CMOS Power ® Intel Super 64Mb I/O BIOS H61 PCIEX1_1 SATA3G_3 SATA3G_1 PCIEX1_2 VIA VT1708S SB_PWR SPEAKER 5 SATA3G_4 SATA3G_2 USB910 USB78 AAFP F_PANEL 11 10 9 8 7 6 1.2.4 Layout contents Connectors/Jumpers/Slots/LED Page Connectors/Jumpers/Slots/LED Page CPU and chassis fan connectors (4-pin 1. 1-19 7. Speaker connector (4-pin SPEAKER) 1-20 CPU_F
Inhaltszusammenfassung zur Seite Nr. 15
1.3 Central Processing Unit (CPU) ® The motherboard comes with a surface mount LGA1155 socket designed for Intel processors. Unplug all power cables before installing the CPU. • Upon purchase of the motherboard, ensure that the PnP cap is on the socket and the socket contacts are not bent. Contact your retailer immediately if the PnP cap is missing, or if you see any damage to the PnP cap/socket contacts/motherboard components. ASUS will shoulder the cost of repair only if the damage is ship
Inhaltszusammenfassung zur Seite Nr. 16
3. Lift the load lever in the direction of the arrow until the load plate is completely lifted. Load plate 4. Remove the PnP cap from the CPU socket by lifting the tab only. PnP cap 5. Position the CPU over the socket, ensuring that the gold triangle is on the bottom-left corner of the socket, and CPU notches then fit the socket alignment keys into the CPU notches. The CPU fits in only one correct orientation. DO NOT force the CPU into the socket to prevent bending Gold the connector
Inhaltszusammenfassung zur Seite Nr. 17
6. Apply some Thermal Interface Material to the exposed area of the CPU that the heatsink will be in contact with, ensuring that it is spread in an even thin layer. Some heatsinks come with pre- applied thermal paste. If so, skip this step. The Thermal Interface Material is toxic and inedible. DO NOT eat it. If it gets into your eyes or touches your skin, wash it off immediately, and seek professional medical help. 7. Close the load plate (A), and then push B down the load lever (B), en
Inhaltszusammenfassung zur Seite Nr. 18
1.3.2 Installing the CPU heatsink and fan ® The Intel LGA1155 processor requires a specially designed heatsink and fan assembly to ensure optimum thermal condition and performance. ® • When you buy a boxed Intel processor, the package includes the CPU fan and ® heatsink assembly. If you buy a CPU separately, ensure that you use only Intel -certified multi-directional heatsink and fan. ® • Your Intel LGA1155 heatsink and fan assembly comes in a push-pin design and requires no tool to install.
Inhaltszusammenfassung zur Seite Nr. 19
3. Connect the CPU fan cable to the connector on the motherboard labeled CPU_FAN. CPU_FAN P8H61-MX R2.0 P8H61-MX Series CPU fan connector Do not forget to connect the CPU fan connector! Hardware monitoring errors can occur if you fail to plug this connector. 1.3.3 Uninstalling the CPU heatsink and fan To uninstall the CPU heatsink and fan: 1. Disconnect the CPU fan cable from the connector on the motherboard. 2. Rotate each fastener counterclockwise. 3. Pull up two fasteners at a time in a dia
Inhaltszusammenfassung zur Seite Nr. 20
4. Carefully remove the heatsink and fan assembly from the motherboard. 5. Rotate each fastener clockwise to ensure correct orientation when reinstalling. 1.4 System memory 1.4.1 Overview The motherboard comes with two Double Data Rate 3 (DDR3) Dual Inline Memory Modules (DIMM) sockets. A DDR3 module has the same physical dimensions as a DDR2 DIMM but is notched differently to prevent installation on a DDR2 DIMM socket. DDR3 modules are developed for better performance with less power cons
