Instrukcja obsługi Transcend Information 2GSDM80

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TS128M~2GSDM80
TS128M~2GSDM80
TS128M~2GSDM80 128M~2GB miniSD Memory Card


Description Features
miniSD Card is a compact, slim and high capacity • Storage Capacity: 2GB(2GX8bit,2KB/page )
storage media with copyright protection. Designed in • Operating Voltage: 2.7 ~ 3.6V
advanced SD specification Ver.1.1, TS2GSDM80 • Operating Temperature: -25 ~ 85°C
now reaches a new performance milestone. Based on • Maximum Data Transfer Rate:
0.18um process controll

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card Architecture 2 Transcend Information Inc.

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card Bus Operating Conditions • General Parameter Symbol Min. Max. Unit Remark Peak voltage on all lines -0.3 VDD+0.3 V All Inputs Input Leakage Current -10 10 µA All Outputs Output Leakage Current -10 10 µA • Power Supply Voltage Parameter Symbol Min. Max. Unit Remark Supply voltage V 2.0 3.6 V CMD0, 15,55,ACMD41 DD commands Supply voltage specified in OCR register 2.7

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card • Bus Signal Levels As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage. To meet the requirements of the JEDEC specification JESD8-1A, the card input and output voltages shall be within the following specified ranges for any V of the allowed voltage range: DD Parameter Symbol Min. Max. Unit Remark Output HIGH voltage

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card • Bus Timing (Default) Parameter Symbol Min Max. Unit Remark Clock CLK (All values are referred to min (V ) and max (V ) IH IL Clock frequency Data Transfer Mode f 0 25 MHz C ≤ 100 pF, (7 cards) PP L Clock frequency Identification Mode f 0 400 KHz C ≤ 250 pF, (21 cards) OD L (The low freq. is required for MultiMediaCard compatibility.) Clock low time t 10 ns C ≤ 100 pF, (7 c

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card 50 ns C ≤ 250 pF, (21 cards) L Clock fall time t 10 ns C ≤ 100 pF, (7 cards) THL L 50 ns C ≤ 250 pF, (21 cards) L Inputs CMD, DAT (referenced to CLK) Input set-up time t 5 ns C ≤ 25 pF, (1 cards) ISU L Input hold time t 5 ns C ≤ 25 pF, (1 cards) IH L Outputs CMD, DAT (referenced to CLK) Output Delay time during Data Transfer Mode t 0 14 ns C ≤ 25 pF, (1 cards) ODLY L Output

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card • Bus Timing (High Speed Mode) Parameter Symbol Min Max. Unit Remark Clock CLK (All values are referred to min (V ) and max (V ) IH IL Clock frequency Data Transfer Mode f 0 50 MHz PP Clock low time t 7 ns WL Clock high time t 7 ns WH Clock rise time t 3 ns TLH Clock fall time t 3 ns THL Inputs CMD, DAT (referenced to CLK) Input set-up time t 6 ns ISU Input hold time

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TS128M~2GSDM80 TS128M~2GSDM80 TS128M~2GSDM80 128M~2GB miniSD Memory Card Output Delay time during Data Transfer Mode t 14 ns ODLY Output Hold time t 2.5 ns OH Total System capacitance for each line C 40 pF L Reliability and Durability Temperature Operation: -25°C / 85°C (Target spec) Storage: -40°C (168h) / 85°C (500h) Junction temperature: max. 95°C Moisture and corrosion Operation: 25°C / 95% rel. humidity Storage: 40°C / 93% rel. hum./500h